Termékek hegesztőgáz gyártó (75)

The production of ophthalmic lenses requires different marking processes, e.g. technical engraving and branding for spectacle lenses as well as UDI marking for contact lenses. 3DMicromac offers ophthalmic marking solutions for laser engraving of all types of ophthalmic lenses, e.g. prescription and sunglasses, or contact lenses. All systems use UV lasers for permanent marking and guarantee Highest engraving precision Accurate contrast adjustment Reliable process stability Maximum throughput Top availability Flexibility in system configuration and Simple retrofitting. 3DMicromac‘s customers can choose between premium quality excimer laser systems and high quality maintenance free DPSS laser systems. Both are suitable for the production of technical engravings and visible branding on blocked and unblocked lenses, as well as contact lenses. The microMARK™ MCF excimer laser system generates the engravings by cold laser ablation of 193 nm UV radiation.

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

3DMicromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full scale manufacturing of crystalline half cells. The microCELL™ TLS system offers half cell and stripe cutting for improved module performance. The TLSTechnology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significant higher module power gain and less module power degradation.

- Formate von 1/2 bis 1/6-Zellen und Größen bis zu M12 - Freiformschneiden - Leistungssteigerung von bis zu 2W durch TLS-Technologie Die patentierte Lasertechnologie von 3D-Micromac zum direkten Schneiden von Solarzellen ist die führende Methode zum Schneiden von Zellen. Wenn herkömmliche Schneidverfahren an ihre Grenzen stoßen, kommt die TLS-Technologie mit ultrakurzen Pulsen ins Spiel. Exzellente Schnittqualitäten mit hoher Reproduzierbarkeit und Genauigkeit können garantiert werden. Egal ob Halbzelle, Drittelzelle, Viertelzelle oder die zukunftsweisende Sechszelle. Durch die große Flexibilität der TLS-Technologie ist es möglich, unsere Kunden umfassend zu unterstützen. Anpassung in der Anzahl der Zellschnitte, Variation in der Größe der Substrate bis zu 220mm oder eine hohe Flexibilität in der Formfreiheit. Von siliziumbasierten Zelltypen wie PERC, TOPCon, HJT bis IBC ist die Bearbeitung Ihrer mono- und polychristalinischen Photovoltaikzellen möglich.

The microVEGA™ xMR system provides high throughput laser annealing for monolithic magnetic sensor formation. A highly flexible tool configuration, the microVEGA™ xMR can accommodate both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjust magnetic orientation, sensor position and sensor dimension—making it an ideal solution for magnetic sensor production. The microVEGA™ xMR uses on-the-fly spot and variable laser energy to provide selective heating of the pinning layer in each sensor in order to “imprint” the intended magnetic orientation. Magnetic field strength and orientation is adjustable by recipe, while high temperature gradients ensure low thermal impact. This allows sensors to be processed directly next to readout electronics as well as closer together, and enables the production of smaller sensors—freeing up space for processing more devices per wafer.

3DMicromac‘s highly versatile microFLEX™ product family is the all-in-one solution for manufacturing flexible thin films in photovoltaics, electronics, medical devices, displays, and semiconductors. The production systems can handle various substrates, material thicknesses, and types such as polymer films, stainless steel, and thin glass. The microFLEX™ systems combine high precision laser processing with cleaning and packaging technologies, as well as inline quality control. Due to its modular concept, various customized solutions are available, reaching from industrial mass production to pilot lines as well as applied research. High throughput and efficiency on-the-fly processing; high machine uptime; multiple tension controllers; contactless substrate guiding Highest flexibility easy machine layout modification by modular concept Cost advantages Long term security of investment; reasonable cost of ownership; easy to upgrade and modify; different micro environments.

The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.

3DMicromac‘s microCELL™ OTF meets cell manufacturers‘ demands for increasing the efficiency of PERC solar cells, by precise surface structuring, low operating costs and highest availability. The system is suitable to process mono and polycrystalline silicon solar cells. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects or microcracks. On-the-fly laser processing with unbeatable cost benefit ratio Contactless wafer handling High throughput and efficiency (> 3.800 wph) Low cost of ownership and CAPEX Upgrade for existing production lines or expansion

The advanced microCELL™ MCS laser cutting system has been developed to meet the photovoltaic (PV) market’s demands for boosting module power output and service life by minimizing power losses and providing for an exceptionally high mechanical strength of cut cells. It enables the highest throughputs for cutting cell sizes up to M12/G12 into half cells or shingled cells. The microCELL™ MCS system takes advantage of 3DMicromac’s patented thermal laser separation (TLS) process for cell separation. The ablation free technique guarantees an excellent edge quality. The microCELL™ MCS system offers half and shingled cell cutting for improved module performance. The TLS Technology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significantly higher module power gain and less module power degradation.

- Formats from 1/2 to 1/6 cells and sizes up to M12 - Free-form cutting - Power increase of up to 2W through TLS technology 3D-Micromac's patented laser technology for direct cutting of solar cells is the leading method for cutting cells. When conventional cutting methods reach their limits, TLS technology with ultra-short pulses comes into play. Excellent cutting qualities with high reproducibility and accuracy can be guaranteed. Whether half-cell, third-cell, quarter-cell or the trend-setting six-cell. The great flexibility of TLS technology makes it possible to provide our customers with comprehensive support. Adaptation in the number of cell cuts, variation in the size of the substrates up to 220mm or a high flexibility in the freedom of shape. From silicon-based cell types such as PERC, TOPCon, HJT to IBC, the processing of your mono- and polychristaline photovoltaic cells is possible.

3DMicromac‘s microSHAPE™ laser system is designed for the processing of large and flat substrates with high accuracy. The highly versatile system allows the combination of different laser processes in a single machine. In addition, it is capable of processing with multiple working heads – this parallel processing makes higher throughputs achievable. microSHAPE™ is an industry proven solution for all kinds of ablative and non-ablative processes. These include cutting, selective removal of thin films, and structuring processes like engraving and marking. The microSHAPE™ system is suitable for machining a variety of materials, e.g. glass, metals, polymer, ceramics, display stacks, and coated substrates. Free form cutting with extraordinary quality Damage free cutting edges Contactless processing enables minimal cost of ownership Cutting speed up to 1.5 m/sec Laser sources according to customer requirements Up to 3 independent beam paths

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

3DMicromac‘s microSTRUCT™ C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems. The microSTRUCT™ C offers a maximal degree of freedom regarding the positioning of the substrates. Flexible, stable and repeatable machining results Two independent and free configurable working areas with various optical setups Open system concept for the integration of different laser sources High range of software functions (Masterscript) User friendly, flexible, upgradeable system

3DMicromac‘s microPRO™ is an adaptable laser micromachining system mainly used in industrial production. Its high versatility makes the system perfectly suited for industrial laser micromachining tasks such as laser structuring, cutting, and drilling applications. Furthermore, it is suitable for a variety of materials, e.g., metals, alloys, transparent and biological substrates, ceramics, and thin film compound systems. The microPRO™ is available with an automatic handling system for wafers, cassettes, trays, etc The microPRO™ enables the laser processing of various substrates. Due to the integration of different technology modules, the platform can be adapted to customers’ requirements. Configuration packages may include High speed cutting Drilling Engraving Structuring and modification Laser Lift Off (LLO) Cylindrical machining Customized solutions